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Sputtering Coating Zirconium Target
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product: view count: 353Sputtering Coating Zirconium Target 
unit price: Negotiable
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period for delivery: Consignment Deadline days
Expiry date: Long Effective
last update: 2025-05-03 08:00
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Zirconium target is a material used in physical vapor deposition (PVD) process, usually used to make thin films. Zirconium (chemical symbol Zr) is a transition metal with excellent corrosion resistance, high melting point and good mechanical properties. Zirconium targets are widely used in semiconductors, optical coatings, decorative coatings and functional films.

 

Melting point: 1852℃
Boiling point: 4400℃
Density: 6.5g/cm³
Specifications: flat target/round target
Implementation standard: ASTM B550 GB/T 8769-2010 GB/T26314-2010

 

Main application areas
1. Semiconductor manufacturing: Zirconium targets are used to deposit high dielectric constant (high-k) films, such as zirconium oxide (ZrO₂), for transistor gate dielectric layers.
2. Optical coatings: Zirconium films have high refractive index and good optical properties, and are often used in anti-reflection films or reflective films for optical devices and lenses.
3. Decorative coating: Zirconium targets can be used to prepare wear-resistant and corrosion-resistant decorative coatings, such as watches, jewelry, etc.
4. Functional thin films: Zirconium thin films can also be used in the preparation of fuel cells, sensors and catalysts.
Characteristics of zirconium targets
High purity: The purity of zirconium targets is usually required to reach more than 99.9% to ensure the performance of the film.
High density: The target requires high density to reduce particle generation during sputtering.
Good uniformity: The chemical composition and microstructure of the target need to be uniform to ensure the consistency of the film.
Preparation process
The preparation of zirconium targets usually includes the following steps:
1. Melting: Prepare high-purity zirconium ingots by vacuum arc melting or electron beam melting.
2. Forging and rolling: Improve the microstructure and mechanical properties of the material through hot processing.
3. Machining: Process the material into a shape and size suitable for sputtering equipment.
4. Cleaning and packaging: Ensure that the target surface is clean to avoid contamination.

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